Biometric sensor with force detection and ultrasonic imaging capability

ABSTRACT

Implementations of the subject matter described herein relate to sensors including piezoelectric micromechanical ultrasonic transducer (PMUT) sensor elements and arrays thereof. The PMUT sensor elements may be switchable between a non-ultrasonic force detection mode and an ultrasonic imaging mode. A PMUT sensor element may include a diaphragm that is capable of a static displacement on application of a force and is capable of a dynamic displacement when the PMUT sensor element transmits or receives ultrasonic signals. In some implementations, a PMUT sensor element includes a two dimensional-electron gas structure on the diaphragm. The sensors may further include a sensor controller configured to switch between a non-ultrasonic force detection mode and an ultrasonic imaging mode for one or more of the PMUT sensor elements, wherein an applied force is measured in the non-ultrasonic force detection mode and wherein an object is imaged ultrasonically during the ultrasonic imaging mode.

INCORPORATION BY REFERENCE

An Application Data Sheet is filed concurrently with this specificationas part of the present application. Each application that the presentapplication claims benefit of or priority to as identified in theconcurrently filed Application Data Sheet is incorporated by referenceherein in its entirety and for all purposes.

TECHNICAL FIELD

This disclosure relates to piezoelectric ultrasonic transducers and toan electronic sensor array of piezoelectric ultrasonic transducers forbiometric sensing, imaging, force detection and touch recognition.

DESCRIPTION OF THE RELATED TECHNOLOGY

Ultrasonic sensor systems may use an ultrasonic transmitter to generateand send an ultrasonic wave through an ultrasonically transmissivemedium or media and towards an object to be detected. The ultrasonictransmitter may be operatively coupled to an ultrasonic sensor arrayconfigured to detect portions of the ultrasonic wave that are reflectedfrom the object. For example, in ultrasonic fingerprint sensors, anultrasonic wave may be produced by starting and stopping the transmitterduring a short interval of time. At each material interface encounteredby the ultrasonic wave, a portion of the ultrasonic wave may bereflected.

For example, in the context of an ultrasonic fingerprint sensor, theultrasonic wave may travel through a platen on which an object such as aperson's finger may be placed to obtain fingerprint image information.After passing through the platen, some portions of the ultrasonic wavemay encounter skin that is in contact with the platen, e.g., fingerprintridges, while other portions of the ultrasonic wave encounter air, e.g.,valleys between adjacent ridges of a fingerprint, and may be reflectedwith different intensities back towards the ultrasonic sensor array. Theultrasonic sensor array may convert the reflected ultrasonic wave intoreflected ultrasonic signals that are indicative of the local intensityof the reflected ultrasonic wave. The reflected signals associated withthe finger may be processed and converted to digital values representingthe signal strengths of the reflected signals. When such reflectedsignals are collected over a distributed area, the digital values ofsuch signals may be used to produce fingerprint image information. Thefingerprint image information may be used to produce a graphical displayof the signal strength over the distributed area, for example byconverting the digital values to an image, thereby producing an image ofthe fingerprint. Thus, an ultrasonic sensor system may be used as afingerprint sensor or other type of biometric scanner.

Thin film piezoelectric acoustic transducers are attractive candidatesfor numerous applications including biometric sensors, ultrasonicimaging devices and fingerprint sensors. Such transducers may includepiezoelectric micromechanical ultrasonic transducers (PMUTs) configuredas a multilayer stack that includes a piezoelectric layer stack and amechanical layer disposed over a cavity. The piezoelectric layer stackmay include a layer of piezoelectric material. In some applications, aone- or two-dimensional array of any number of PMUT sensor elements maybe contemplated.

Low-cost and low-power authenticating wake-up mechanisms are of interestin electronic devices such as smartphones, tablets, and self-drivingcars, but significant challenges are present. Capacitive touch detectionmechanisms may be unable to differentiate a determined touch from aninadvertent one, leading to unwanted wake-up events. A light touch by afinger on a fingerprint sensor may result in poor image quality, makingauthentication of a user more difficult.

SUMMARY

The systems, methods and devices of this disclosure each have severalinnovative aspects, no single one of which is solely responsible for thedesirable attributes disclosed herein.

One innovative aspect of the subject matter described in this disclosurerelates to an apparatus including a substrate; a sensor including anarray of piezoelectric micromechanical ultrasonic transducer (PMUT)sensor elements on the substrate, where each PMUT sensor elementincludes a diaphragm having a piezoelectric layer and a mechanicallayer, where the diaphragm is capable of a static displacement uponapplication of an applied force and is capable of a dynamic displacementwhen the PMUT sensor element receives or transmits ultrasonic signals;and a sensor controller configured to switch the sensor between anon-ultrasonic force detection mode and an ultrasonic imaging mode forone or more of the PMUT sensor elements, where the applied force ismeasured in the non-ultrasonic force detection mode and where an objectis imaged ultrasonically during the ultrasonic imaging mode. In someimplementations, the apparatus is configured to detect a finger touchbased on an on-threshold force being measured by the apparatus in thenon-ultrasonic force detection mode. In some implementations, the sensorcontroller may be configured to provide, to an applications processor, awake-up signal to activate one or more wake-up operations after thefinger touch is detected. In some such implementations, the apparatus isconfigured to detect a finger lift after a detecting the finger touchbased on an off-threshold force being measured by the apparatus in thenon-ultrasonic force detection mode. In some implementations, theoff-threshold force is less than the on-threshold force. In someimplementations, the sensor controller is configured to initialize theultrasonic imaging mode after the finger touch is detected.

In some implementations, the sensor controller is configured toinitialize the ultrasonic imaging mode based on a minimum imagingthreshold force being measured by the apparatus in the non-ultrasonicforce detection mode. In some implementations, one or more of the PMUTsensor elements includes a 2-D electron gas structure disposed on thediaphragm. In some implementations, the sensor controller is configuredto switch between the non-ultrasonic force detection mode and anultrasonic imaging mode for each of the PMUT sensor elements in thearray of PMUT sensor elements. In some implementations, the sensorcontroller is configured to switch between the non-ultrasonic forcedetection mode and an ultrasonic imaging mode for a subset of the PMUTsensor elements in the array of PMUT sensor elements.

In some implementations, PMUT sensor elements of the subset of the PMUTsensor elements are located at the periphery of the array of PMUT sensorelements. In some such implementations, the PMUT sensor elements of thesubset of the PMUT sensor elements differ from the remainder of the PMUTsensor elements of the array of PMUT sensor elements in one or more of ashape or a size.

Another innovative aspect of the subject matter described in thisdisclosure relates to a method of operating a fingerprint sensor,including measuring a finger force of a finger positioned on thefingerprint sensor, imaging the finger when the finger force exceeds apressed-finger threshold level, and authenticating the finger based onimaging the finger. In some implementations, imaging the finger includesacquiring ultrasonic image information of the finger and whereauthenticating the finger is based on the ultrasonic image information.In some implementations, imaging the finger includes acquiringultrasonic image information of the finger when the finger force exceedsa minimum imageable-finger threshold level. In some implementations,imaging the finger includes acquiring ultrasonic image information ofthe finger when the finger force is less than a maximum imageable-fingerthreshold level. In some implementations, the method further includeswaking up at least a portion of a mobile device when the finger forceexceeds the pressed-finger threshold level. In some implementations, themethod further includes reducing a sampling rate for measuring thefinger force when the finger force is less than a lifted-fingerthreshold level.

Another innovative aspect of the subject matter described in thisdisclosure relates to an apparatus including a substrate; a diaphragmincluding a mechanical layer disposed over a cavity, the cavity beingpositioned between the diaphragm and the substrate; and a 2-D electrongas structure disposed on the diaphragm. In some implementations, the2-D electron gas structure is an aluminum gallium nitride/galliumnitride (AlGaN/GaN) transistor. In some implementations, the diaphragmand the 2-D electron gas structure are part of a sensor element, thediaphragm is capable of a static displacement upon application of anapplied force, and the 2-D electron gas structure is a strain-sensitivestructure configured to provide a static displacement signal thatcorresponds to the applied force. In some implementations, the diaphragmis further capable of a dynamic displacement when the sensor elementreceives or transmits ultrasonic signals. In some such implementations,the apparatus further includes a sensor controller configured to switchthe sensor element between a non-ultrasonic force detection mode and anultrasonic imaging mode, where the applied force is measured in thenon-ultrasonic force detection mode and where an object is imagedultrasonically during the ultrasonic imaging mode.

In some implementations where the sensor element is one of an array ofsensor elements on the substrate, each sensor element includes adiaphragm and a mechanical layer disposed over a cavity, the cavitybeing positioned between the diaphragm and the substrate, and eachsensor element includes a 2-D electron gas structure disposed on thediaphragm. In some implementations, the apparatus further includes anarray of piezoelectric micromechanical ultrasonic transducer (PMUT)sensor elements on the substrate.

In some implementations, the apparatus further comprises a piezoelectriclayer stack disposed on the diaphragm, where the piezoelectric layerstack is configured to excite the diaphragm and generate ultrasonicwaves. In some implementations, the 2-D electron gas structure isconfigured to detect static displacements or dynamic displacements ofthe diaphragm.

Another innovative aspect of the subject matter described in thisdisclosure relates to a non-transitory computer readable medium storinginstructions executable by one or more processors coupled to afingerprint sensor, the fingerprint sensor including an array ofpiezoelectric ultrasonic transducer (PMUT) sensor elements, theinstructions including: instructions for operating the PMUT sensorelements in a force detection mode; instructions for measuring anapplied force on the fingerprint sensor operating in the force detectionmode; instructions for determining that a finger of a user has touchedthe fingerprint sensor based on the measured applied force; instructionsfor operating the PMUT sensor elements in an ultrasonic imaging mode toacquire fingerprint image information of the finger; and instructionsfor authenticating the user based on the fingerprint image information.

In some implementations, the instructions for determining that a fingerhas touched the fingerprint sensor based on the applied force includeinstructions for comparing the applied force to an on-threshold force.In some implementations, the instructions further include instructionsfor determining, after detecting that the finger has touched thefingerprint sensor, that the finger has lifted off the fingerprintsensor based on an off-threshold force being measured by the apparatusin the non-ultrasonic force detection mode. In some suchimplementations, the off-threshold force is less than the on-thresholdforce. In some implementations, the apparatus further includesinstructions for determining that the applied force is greater than orequal to a minimum imaging threshold force. In some implementations, theapparatus further includes instructions for initializing the ultrasonicimaging mode after determining that the applied force is greater than orequal to a minimum imaging threshold force.

Another innovative aspect of the subject matter described in thisdisclosure relates to an apparatus including a substrate; a sensorincluding an array of piezoelectric micromechanical ultrasonictransducer (PMUT) sensor elements on the substrate, where each PMUTsensor element includes a diaphragm having a piezoelectric layer and amechanical layer, where the diaphragm is capable of a staticdisplacement upon application of an applied force and is capable of adynamic displacement when the PMUT sensor element receives or transmitsultrasonic signals; and means electrically coupled to the sensor forswitching the sensor between a non-ultrasonic force detection mode andan ultrasonic imaging mode for one or more of the PMUT sensor elements,where the applied force is measured in a non-ultrasonic force detectionmode and where an object is imaged ultrasonically during an ultrasonicimaging mode. In some implementations, the apparatus further includesmeans for determining that a finger has touched the sensor. In someimplementations, the apparatus further includes means for determiningthat the finger has lifted off the sensor.

BRIEF DESCRIPTION OF THE DRAWINGS

Details of one or more implementations of the subject matter describedin this specification are set forth in this disclosure and theaccompanying drawings. Other features, aspects and advantages willbecome apparent from a review of the disclosure. Note that the relativedimensions of the drawings and other diagrams of this disclosure may notbe drawn to scale. The sizes, thicknesses, arrangements, materials,etc., shown and described in this disclosure are made only by way ofexample and should not be construed as limiting. Like reference numbersand designations in the various drawings indicate like elements.

FIGS. 1A and 1B illustrate side and top views, respectively, of anexample of a piezoelectric micromechanical ultrasonic transducer (PMUT)sensor element having switchable non-ultrasonic force/touch detectioncapability and ultrasonic imaging capability.

FIG. 1C illustrates a side view of an example of the PMUT sensor elementshown in FIGS. 1A and 1B operating in a non-ultrasonic force/touchdetection mode.

FIG. 1D illustrates a side view of an example of the PMUT sensor elementshown in FIGS. 1A and 1B operating in an ultrasonic imaging mode.

FIG. 1E is an example of a schematic of an equivalent circuit of thePMUT sensor element 100 shown in FIGS. 1C and 1D.

FIG. 2 illustrates a side view of an example configuration of a PMUTultrasonic sensor array capable of ultrasonic imaging.

FIG. 3A shows a block diagram representation of components of an examplesensing system 300 according to some implementations.

FIG. 3B shows a block diagram representation of components of an examplemobile device that includes the sensing system of FIG. 3A.

FIG. 4A shows an example of a flow diagram illustrating a process forforce/touch detection, fingerprint imaging, and authentication using asensor system including an ultrasonic sensor array according to certainimplementations.

FIG. 4B shows an example of a flow diagram illustrating a process forforce/touch detection, finger-lift detection, fingerprint imaging, andauthentication using a sensor system including an ultrasonic sensorarray.

FIG. 5A is an example of a diagram illustrating applied finger forceversus time for finger-touch detection and finger-lift detection eventsof a fingerprint sensor operating in a non-ultrasonic force detectionmode.

FIG. 5B is an example of a diagram illustrating applied finger forceversus time for imaging performed by a fingerprint sensor operating inan ultrasonic imaging mode.

FIG. 6 is an example of a diagram illustrating a non-ultrasonicforce/touch detection mode and an ultrasonic imaging mode of afingerprint sensor versus applied finger force.

FIGS. 7A-7C illustrate an example of a PMUT sensor element that includesa 2-D electron gas structure.

FIG. 7D illustrates a side view of an example of a 2-D electron gasstructure that may be implemented with or without the PMUT sensorelements described herein.

FIGS. 8-13 illustrate examples of various configurations of ultrasonicsensor arrays that are configured to switch between a non-ultrasonicforce detection mode and an ultrasonic imaging mode.

FIGS. 14A-17D illustrate examples of PMUT sensor elements that may beimplemented in ultrasonic sensor arrays according to variousimplementations.

FIGS. 18A-18D illustrate an example of a process flow for fabricating asensor element including a substrate, a diaphragm, and a 2-D electrongas structure disposed on the diaphragm.

DETAILED DESCRIPTION

The following description is directed to certain implementations for thepurposes of describing the innovative aspects of this disclosure.However, a person having ordinary skill in the art will readilyrecognize that the teachings herein may be applied in a multitude ofdifferent ways. The described implementations may be implemented in anydevice, apparatus, or system for ultrasonic sensing. In addition, it iscontemplated that the described implementations may be included in orassociated with a variety of electronic devices such as, but not limitedto: mobile telephones, multimedia Internet enabled cellular telephones,mobile television receivers, wireless devices, smartphones, smart cards,wearable devices such as bracelets, armbands, wristbands, rings,headbands, patches, etc., Bluetooth® devices, personal data assistants(PDAs), wireless electronic mail receivers, hand-held or portablecomputers, netbooks, notebooks, smartbooks, tablet computers, printers,copiers, scanners, facsimile devices, global positioning system (GPS)receivers/navigators, cameras, digital media players (such as MP3players), camcorders, game consoles, wrist watches, clocks, calculators,television monitors, flat panel displays, electronic reading devices(e.g., e-readers), mobile health devices, computer monitors, autodisplays (including odometer and speedometer displays, etc.), cockpitcontrols and/or displays, camera view displays (such as the display of arear view camera in a vehicle), electronic photographs, electronicbillboards or signs, projectors, architectural structures, microwaves,refrigerators, stereo systems, cassette recorders or players, DVDplayers, CD players, VCRs, radios, portable memory chips, washers,dryers, washer/dryers, automatic teller machines (ATMs), parking meters,packaging (such as in electromechanical systems (EMS) applicationsincluding microelectromechanical systems (MEMS) applications as well asnon-EMS applications), aesthetic structures (such as display of imageson a piece of jewelry or clothing) and a variety of EMS devices. Theteachings herein also may be used in applications such as, but notlimited to, electronic switching devices, radio frequency filters,sensors, accelerometers, gyroscopes, motion-sensing devices,magnetometers, inertial components for consumer electronics, parts ofconsumer electronics products, automobile doors, steering wheels orother automobile parts, varactors, liquid crystal devices,electrophoretic devices, drive schemes, manufacturing processes andelectronic test equipment. Thus, the teachings are not intended to belimited to the implementations depicted solely in the Figures, butinstead have wide applicability as will be readily apparent to onehaving ordinary skill in the art.

Implementations of the subject matter described herein relate topiezoelectric micromechanical ultrasonic transducer (PMUT) sensorelements and arrays thereof. The PMUT sensor elements may be switchablebetween a non-ultrasonic force detection mode and an ultrasonic imagingmode. A PMUT sensor element may include a diaphragm that is capable of astatic displacement on application of a force from an object such as afinger and is capable of a dynamic displacement when the PMUT sensorelement transmits or receives ultrasonic signals. In someimplementations, a PMUT sensor element may include a twodimensional-electron gas structure on the diaphragm.

Implementations of the subject matter described herein also relate tosensors including an array of PMUT sensor elements. The sensors mayfurther include a sensor controller configured to switch between anon-ultrasonic force detection mode and an ultrasonic imaging mode forone or more of the PMUT sensor elements, wherein an applied force ismeasured in the non-ultrasonic force detection mode and wherein anobject is imaged ultrasonically during the ultrasonic imaging mode.Forces that exceed threshold force levels for wake-up and imaging may bedetected and responded to accordingly.

Particular implementations of the subject matter described in thisdisclosure may be implemented to realize one or more of the followingpotential advantages. In a non-ultrasonic force detection mode, thesensors allow low-power wake-up of a device. By detecting forces thatexceed a threshold force level, the sensor can be made insensitive tolight, inadvertent touches with unintentional wake-up reduced. Imagequality control for fingerprint imaging may be improved by using athreshold force level for imaging.

Aspects of PMUTS have been described in U.S. patent application Ser. No.14/569,280, filed on Dec. 12, 2014 and entitled “MICROMECHANICALULTRASONIC TRANSDUCERS AND DISPLAY,” and in U.S. patent application Ser.No. 14/569,256, filed on Dec. 12, 2014 and entitled “PIEZOELECTRICULTRASONIC TRANSDUCER AND PROCESS,” U.S. patent application Ser. No.14/883,583, filed on Oct. 14, 2015 and entitled “THREE-PORTPIEZOELECTRIC ULTRASONIC TRANSDUCER,” U.S. patent application Ser. No.14/883,585, filed on Oct. 14, 2015 and entitled “ACTIVE BEAM-FORMINGTECHNIQUE FOR PIEZOELECTRIC ULTRASONIC TRANSDUCER ARRAY,” U.S. patentapplication Ser. No. 14/883,586, filed on Oct. 14, 2015 and entitled“SUPERPIXEL ARRAY OF PIEZOELECTRIC ULTRASONIC TRANSDUCERS FOR 2-DBEAMFORMING,” and U.S. patent application Ser. No. 15/292,057, filedOct. 12, 2016 and entitled “INTEGRATED PIEZOELECTRIC MICROMECHANICALULTRASONIC TRANSDUCER PIXEL AND ARRAY,” each owned by the assignee ofthe present invention and hereby incorporated by reference into thepresent application in its entirety for all purposes.

FIGS. 1A and 1B illustrate side and top views, respectively, of anexample of a piezoelectric micromechanical ultrasonic transducer (PMUT)sensor element having switchable non-ultrasonic force/touch detectioncapability and ultrasonic imaging capability. Referring to FIG. 1A, thePMUT sensor element 100 includes a piezoelectric layer stack 110 and amechanical layer 130 disposed to form a diaphragm (which may be referredto hereinbelow as a “PMUT diaphragm” or “deformable diaphragm”)supported by an anchor structure 170 over a cavity 120. Thepiezoelectric layer stack 110 includes a piezoelectric layer 115, alower electrode 112 and an upper electrode 114. The upper electrode 114in the illustrated implementation may also be referred to as an innerelectrode as it is disposed on an interior portion of the deformablediaphragm.

In the illustrated implementation, the lower electrode 112 is disposedbelow the piezoelectric layer 115 and proximate to the cavity 120,whereas the upper electrode 114 is disposed above the piezoelectriclayer 115, proximate to a surface of the piezoelectric layer 115 that isopposite to the cavity 120. The cavity 120 may be formed in or on asubstrate 160. The cavity 120 is positioned between the diaphragm andthe substrate 160. In implementations in which the cavity is formed inthe substrate 160, such as a cavity-silicon-on-insulator implementation,the anchor structure 170 may be part of the substrate 160.

The substrate 160 may be or include, for example, a silicon wafer, asilicon-on-insulator (SOI) wafer, a silicon or SOI wafer with integratedcircuitry, a semiconductor substrate, or a glass or polymer substratewith thin film transistor (TFT) circuitry. In some implementations, thesubstrate 160 may be a flexible substrate such as a thin layer ofpolyimide (PI), polyethylene naphthalate (PEN) or polyethyleneterephthalate (PET), or a flexible substrate with InGaZnO (IGZO)circuitry.

The piezoelectric layer stack may include a piezoelectric layer such asaluminum nitride (AlN), zinc oxide (ZnO), lead-zirconate titanate (PZT)or other suitable piezoelectric material with one or more electrodelayers electrically coupled to the piezoelectric layer. Thepiezoelectric layer stack may be patterned and etched to form vias,release holes and other features. The mechanical layer may includesilicon dioxide (SiO2), silicon oxynitride (SiON), silicon nitride(SiN), other dielectric material, or a combination of dielectricmaterials or layers. In some examples, the diaphragm may be configuredas an elongated rectangle having a longitudinal dimension of length Land a width W, with L being at least two times W. In some examples, thediaphragm may have a width W to thickness T ratio of between 5:1 to50:1.

As can be seen in FIG. 1B, the PMUT sensor element 100 may have acircular geometry. The PMUT sensor element 100 is an example of atwo-port PMUT, which is a PMUT having two input/output ports, oneassociated with lower electrode 112 and one associated with upperelectrode 114. The lower electrode 112 is a reference electrode at avoltage V_(ref) and the upper electrode 114 is an output/drive/senseelectrode at a voltage V_(inner). The transceiver circuitry 180 isschematically shown as connected to the lower electrode 112 and upperelectrode 114. The transceiver circuitry 180 may be electrically coupledwith the PMUT sensor element 100 by way of the two input/output portsassociated with the transceiver circuitry 180.

In the example of FIGS. 1A and 1B, the upper electrode 114 may bereferred to as an inner electrode. In some implementations, describedfurther below, a three-port PMUT sensor element may have two upperelectrodes, for example an inner upper electrode and an outer upperelectrode with the outer electrode proximate the peripheral region ofthe deformable diaphragm. The PMUT sensor elements described herein arenot limited to any particular geometry. Further examples of two-port andthree-port PMUT sensor elements having various geometries are describedbelow with reference to FIGS. 7A-7C and 14A-17D.

FIG. 1C illustrates a side view of an example of the PMUT sensor element100 shown in FIGS. 1A and 1B operating in a non-ultrasonic force/touchdetection mode. FIG. 1D illustrates a side view of an example of thePMUT sensor element 100 shown in FIGS. 1A and 1B operating in anultrasonic imaging mode. Turning to FIG. 1C, the PMUT sensor element 100is shown with the deformable PMUT diaphragm having a static displacementdue to an applied force, as indicated by the downward directed arrowsand the dashed deformed diaphragm lines. In operation, the piezoelectriclayer stack 110 and the mechanical layer 130 are caused to bend inresponse to the applied force, which the PMUT sensor element converts toan electrical signal that may be read by the transceiver circuitry 180shown in FIG. 1B. In implementations described herein, the force can beapplied, for example, by a finger or stylus pressing on the PMUT sensorelement 100 or on a platen, cover glass, or other device enclosure thatoverlies the PMUT sensor element 100. The output voltage V_(inner) canbe measured and is generally proportional to the applied force. Itshould be understood that while the description herein refers chiefly toforce detection, the sensor elements may also be implemented forpressure detection, with pressure being the ratio of force over an areato which it is applied. Force or pressure detection allows detection ofa finger touch, at least to the extent that a touch (e.g., a lighttouch) from a finger of a user or other object exerts a detectable forceon one or more of the sensor elements. FIG. 1E is an example of aschematic of an equivalent circuit of the PMUT sensor element 100 shownin FIGS. 1C and 1D. FIG. 1E shows the electrical connections to theinner electrode and the reference electrode and the surface charge thatdevelops on the surfaces of the piezoelectric layer when the diaphragmis deformed.

In some implementations, the deflection of the PMUT diaphragm withapplied force from a finger generates a charge that may be used to powera small front-end portion of an associated controller. For example, thecharge generated by the piezoelectric layer upon static deflection maybe stored in a power supply capacitor that may in turn power front-endcircuitry of the associated controller. The front-end portion may beused to wake up other portions of the controller or to perform athreshold detection function to avoid waking up the controller and/or anassociated applications processor unless a minimum threshold force hasbeen applied.

In some implementations, described further below with respect to FIGS.7A-7D, the PMUT sensor element 100 may incorporate a 2-D electron gasstructure such as a 2-D gas transistor. Such 2-D electron gas structuresare sensitive to strain due to applied force and may be used in thestatic displacement, non-ultrasonic force detection mode or in a dynamicdisplacement mode. Sensor elements with a diaphragm and a 2-D electrongas structure disposed on the diaphragm may be used to image an objectultrasonically during an ultrasonic imaging mode.

FIG. 1D illustrates a side view of the PMUT sensor element 100 withdynamic displacements due to ultrasonic wave generation and detection.During operation, the piezoelectric layer stack 110 and the mechanicallayer 130 may be caused to bend and vibrate in response to atime-varying excitation voltage applied across the upper electrode 114and the lower electrode 112 by transceiver circuitry 180. As a result,one or more ultrasonic pressure waves having frequencies in anultrasonic frequency band may be propagated into air, a platen, a coverglass, a device enclosure, or other propagation medium that overlies thePMUT sensor element 100. The piezoelectric layer stack 110 may likewisereceive reflected ultrasonic pressure waves from an object in thepropagation medium, and convert the received ultrasonic pressure wavesinto electrical signals that may be read by the transceiver circuitry180. The deformable diaphragm over the cavity 120 may bend and vibratein response to the reflected ultrasonic pressure wave impinging on asurface of the PMUT sensor element 100, generating mechanical stressesand strains in the PMUT diaphragm and generating surface charge on thesurfaces of the piezoelectric layer 115 that may be detected byunderlying circuitry. The PMUT diaphragm may undergo one or both ofdynamic flexural motion and vibration when the PMUT transmits orreceives ultrasonic signals. The deformable PMUT diaphragm havingdynamic displacements in a transmit mode or a receive mode are indicatedin FIG. 1D by the upward and downward directed arrows and the dasheddeformed diaphragm lines. In the depicted implementation, the lowerelectrode 112 may be connected to a constant bias voltage V_(ref) suchas a ground reference potential. In some implementations the lowerelectrode 112 may be grounded or connected to a multi-level bias signalsuch as a receiver bias voltage that may be provided by the transceivercircuitry 180. The upper electrode 114 is at a drive or sense voltage(V_(inner)).

In some implementations, an array of PMUT sensor elements may beconfigured as an ultrasonic sensor array that is configured forultrasonic fingerprint imaging. FIG. 2 illustrates a side view of anexample configuration of a PMUT ultrasonic sensor array capable ofultrasonic imaging. FIG. 2 depicts an ultrasonic sensor array 200 withan array of PMUTs configured as transmitting and receiving elements thatmay be used for ultrasonic imaging. PMUT sensor elements 262 on a PMUTsensor array substrate 260 may emit and detect ultrasonic waves. Asillustrated, an ultrasonic wave 264 may be transmitted from at one ormore PMUT sensor elements 262. The ultrasonic wave 264 may travelthrough a propagation medium such as an acoustic coupling medium 265 anda platen 290 towards an object 202 such as a finger or a styluspositioned on an outer surface of the platen 290. A portion of theultrasonic wave 264 may be transmitted through the platen 290 and intothe object 202, while a second portion is reflected from the surface ofplaten 290 back towards the PMUT sensor element 262. The amplitude ofthe reflected wave may depend in part on the acoustic properties of theobject 202 and the platen 290. The reflected wave may be detected by thePMUT sensor elements 262, from which an image of the object 202 may beacquired. For example, with sensor arrays having a pitch of about 50microns (about 500 pixels per inch), ridges and valleys of a fingerprintmay be detected. An acoustic coupling medium 265, such as an adhesive,gel, a compliant layer or other acoustic coupling material may beprovided to improve coupling between an array of PMUT sensor elements262 disposed on the sensor array substrate 260 and the platen 290. Theacoustic coupling medium 265 may aid in the transmission of ultrasonicwaves to and from the PMUT sensor elements 262. The platen 290 mayinclude, for example, a layer of glass, plastic, sapphire, metal, metalalloy, or other platen material. An acoustic impedance matching layer(not shown) may be disposed on an outer surface of the platen 290. Theplaten 290 may include a coating (not shown) on the outer surface. Insome implementations, PMUT sensor elements may be co-fabricated withthin-film transistor (TFT) circuitry or CMOS circuitry on or in the samesubstrate, which may be a silicon, SOI, glass or plastic substrate, insome examples. The TFT, silicon or semiconductor substrate may includerow and column addressing electronics, multiplexers, local amplificationstages and control circuitry.

An ultrasonic sensor array may be part of a sensing system of a device,for example, a mobile device. FIG. 3A shows a block diagramrepresentation of components of an example sensing system 300 accordingto some implementations. As shown, the sensing system 300 may include asensor system 302 and a control system 304 electrically coupled to thesensor system 302. The sensor system 302 may be capable of detecting thepresence of an object, for example a human finger. The sensor system 302may be capable of scanning an object and providing raw measured imageinformation usable to obtain an object signature, for example, afingerprint of a human finger. The control system 304 may be capable ofcontrolling the sensor system 302 and processing the raw measured imageinformation received from the sensor system. In some implementations,the sensing system 300 may include an interface system 306 capable oftransmitting or receiving data, such as raw or processed measured imageinformation, to or from various components within or integrated with thesensing system 300 or, in some implementations, to or from variouscomponents, devices or other systems external to the sensing system.

FIG. 3B shows a block diagram representation of components of an examplemobile device 310 that includes the sensing system 300 of FIG. 3A. Thesensor system 302 of the sensing system 300 of the mobile device 310 maybe implemented with an ultrasonic sensor array 312, such as the PMUTultrasonic sensor array 200 shown in FIG. 2. The control system 304 ofthe sensing system 300 may be implemented with a controller 314 that iselectrically coupled to the ultrasonic sensor array 312. While thecontroller 314 is shown and described as a single component, in someimplementations, the controller 314 may collectively refer to two ormore distinct control units or processing units in electricalcommunication with one another. In some implementations, the controller314 may include one or more of a general purpose single- or multi-chipprocessor, a central processing unit (CPU), a digital signal processor(DSP), an applications processor, an application specific integratedcircuit (ASIC), a field programmable gate array (FPGA) or otherprogrammable logic device (PLD), discrete gate or transistor logic,discrete hardware components, or any combination thereof designed toperform the functions and operations described herein.

The sensing system 300 of FIG. 3B may include an image processing module318. In some implementations, raw measured image information provided bythe ultrasonic sensor array 312 may be sent, transmitted, communicatedor otherwise provided to the image processing module 318. The imageprocessing module 318 may include any suitable combination of hardware,firmware and software configured, adapted or otherwise operable toprocess the image information provided by the ultrasonic sensor array312. In some implementations, the image processing module 318 mayinclude signal or image processing circuits or circuit componentsincluding, for example, amplifiers (such as instrumentation amplifiersor buffer amplifiers), analog or digital mixers or multipliers,switches, analog-to-digital converters (ADCs), passive or active analogfilters, among others. In some implementations, one or more of suchcircuits or circuit components may be integrated within the controller314, for example, where the controller 314 is implemented as asystem-on-chip (SoC) or a system-in-package (SIP). In someimplementations, one or more of such circuits or circuit components maybe integrated within a DSP included within or coupled to the controller314. In some implementations, the image processing module 318 may beimplemented at least partially via software. For example, one or morefunctions of, or operations performed by, one or more of the circuits orcircuit components just described may instead be performed by one ormore software modules executing, for example, in a processing unit ofthe controller 314 (such as in a general purpose processor or a DSP).

In some implementations, in addition to the sensing system 300, themobile device 310 may include a separate processor 320 such as anapplications processor, a memory 322, an interface 316 and a powersupply 324. In some implementations, the controller 314 of the sensingsystem 300 may control the ultrasonic sensor array 312 and the imageprocessing module 318, and the processor 320 of the mobile device 310may control other components of the mobile device 310. In someimplementations, the processor 320 may communicate data to thecontroller 314 including, for example, instructions or commands. In somesuch implementations, the controller 314 may communicate data to theprocessor 320 including, for example, raw or processed imageinformation. It should also be understood that, in some otherimplementations, the functionality of the controller 314 may beimplemented entirely, or at least partially, by the processor 320. Insome such implementations, a separate controller 314 for the sensingsystem 300 may not be required because the functions of the controller314 may be performed by the processor 320 of the mobile device 310.

Depending on the implementation, one or both of the controller 314 andprocessor 320 may store data in the memory 322. For example, the datastored in the memory 322 may include raw measured image information,filtered or otherwise processed image information, estimated PSF orestimated image information, and final refined PSF or final refinedimage information. The memory 322 may store processor-executable code orother executable computer-readable instructions capable of execution byone or both of the controller 314 and the processor 320 to performvarious operations (or to cause other components such as the ultrasonicsensor array 312, the image processing module 318, or other modules toperform operations), including any of the calculations, computations,estimations or other determinations described herein (including thosepresented in any of the equations below). It should also be understoodthat the memory 322 may collectively refer to one or more memory devices(or “components”). For example, depending on the implementation, thecontroller 314 may have access to and store data in a different memorydevice than the processor 320. In some implementations, one or more ofthe memory components may be implemented as a NOR- or NAND-based Flashmemory array. In some other implementations, one or more of the memorycomponents may be implemented as a different type of non-volatilememory. Additionally, in some implementations, one or more of the memorycomponents may include a volatile memory array such as, for example, atype of RAM.

In some implementations, the controller 314 or the processor 320 maycommunicate data stored in the memory 322 or data received directly fromthe image processing module 318 through an interface 316. For example,such communicated data can include image information or data derived orotherwise determined from image information. The interface 316 maycollectively refer to one or more interfaces of one or more varioustypes. In some implementations, the interface 316 may include a memoryinterface for receiving data from or storing data to an external memorysuch as a removable memory device. Additionally or alternatively, theinterface 316 may include one or more wireless network interfaces or oneor more wired network interfaces enabling the transfer of raw orprocessed data to, as well as the reception of data from, an externalcomputing device, system or server.

A power supply 324 may provide power to some or all of the components inthe mobile device 310. The power supply 324 may include one or more of avariety of energy storage devices. For example, the power supply 324 mayinclude a rechargeable battery, such as a nickel-cadmium battery or alithium-ion battery. Additionally or alternatively, the power supply 324may include one or more supercapacitors. In some implementations, thepower supply 324 may be chargeable (or “rechargeable”) using poweraccessed from, for example, a wall socket (or “outlet”) or aphotovoltaic device (or “solar cell” or “solar cell array”) integratedwith the mobile device 310. Additionally or alternatively, the powersupply 324 may be wirelessly chargeable.

As used hereinafter, the term “processing unit” refers to anycombination of one or more of a controller of an ultrasonic system (forexample, the controller 314), an image processing module (for example,the image processing module 318), or a separate processor of a devicethat includes the ultrasonic system (for example, the processor 320). Inother words, operations that are described below as being performed byor using a processing unit may be performed by one or more of acontroller of the ultrasonic system, an image processing module, or aseparate processor of a device that includes the sensing system.

As described above, the ultrasonic sensor array may be configured tooperate in a static, non-ultrasonic mode to detect the force of a fingeror other object pressing on the sensor. Once the presence of a finger isdetected, the fingerprint may be imaged ultrasonically by the sensor anda user authenticated. FIG. 4A shows an example of a flow diagramillustrating a process 400 for force/touch detection, fingerprintimaging, and authentication using a sensor system including anultrasonic sensor array according to certain implementations. It shouldbe noted with respect to FIG. 4A, as well as with respect to FIG. 4Bbelow, that functions that are run independently of force/touchdetection (e.g., background routines or applications) are not shown forclarity.

The process 400 begins at block 402 with measuring the static forceF_(static) at the next sampling event. Example sampling rates may rangefrom less than about 5 events per second to 20 events per second ormore. The static force may be measured for one or more sensor elementsin the ultrasonic sensor array as described above with respect to FIG.1C for a single PMUT sensor element. The process 400 continues at adecision block 404 where the measured static force F_(static) iscompared to an on-threshold force level, F_(on,min). In one example, theon-threshold level may be 20 gram-force (gf). However, it is understoodthat the on-threshold level may depend on a particular sensor, device,and/or user. In some implementations, a user-specific on-threshold levelmay be determined during an enrollment process. If the measured staticforce is less than the on-threshold level, the process 400 returns toblock 402. If the measured static force is greater than or equal to theon-threshold level, a finger touch is detected and a pressed-fingercondition may be entered. The pressed-finger condition may be enteredwhen the measured finger force exceeds the on-threshold level, alsoreferred to as the pressed-finger threshold level. The process 400 thencontinues at block 406 with performing wake-up operations due to thedetection of the finger touch. For example, referring back to FIG. 3B,the processor 320 may be activated from a sleep mode or off state by thecontroller 314. In some implementations, a controller or applicationsprocessor may also turn on a display. In some implementations, enteringthe pressed-finger condition may include waking up at least a portion ofthe mobile device (such as a portion of the applications processor or aportion of the display) when the measured finger force exceeds thepressed-finger threshold. The process then continues at block 420 withimaging the fingerprint ultrasonically. Block 420 may be performed asdescribed above with respect to FIG. 1D and FIG. 2. The process 400continues at block 422 with running an authentication process. Block 422may involve determining if the fingerprint imaged in block 420 belongsto an enrolled user.

In some implementations, the sensor may detect when a finger is liftedfrom the sensor and modify operations of a mobile device accordingly.FIG. 4B shows an example of a flow diagram illustrating a process 401for force/touch detection, finger-lift detection, fingerprint imaging,and authentication using a sensor system including an ultrasonic sensorarray as described herein.

The process 401 begins with blocks 402, 404, and 406 performed asdescribed above with respect to FIG. 4A. After a minimum-force fingertouch is detected and one or more wake-up operations are activated orotherwise performed at block 406, the process 401 continues at block 408with measuring the static force. The sampling rate for block 408 may bethe same or different as for block 402. The process 401 continues at adecision block 410 where the measured static force F_(static) iscompared to an off-threshold force level, F_(off,max). The off-thresholdlevel is typically less than the on-threshold level. In one example, anoff-threshold level may be 10 gf or 10 gf less than the on-thresholdlevel. However, it is understood that an off-threshold level may dependon the particular sensor, device, and/or enrolled user. In someimplementations, a user-specific off-threshold level may be determinedduring an enrollment process. If the measured static force is less thanthe off-threshold level, a finger lift is detected and a lifted-fingercondition may be entered. The lifted-finger condition may be enteredwhen the measured finger force is less than the off-threshold level,also referred to as the lifted-finger threshold level. The process 401then continues at block 412 with modifying operations due to detectionof the finger lift, such as reducing the sampling rate at which thestatic finger force is measured. The process may then return to block402. If the measured static force is not less than the off-thresholdlevel, the process 401 continues at block 414 with measuring the staticforce at the next sampling event. The sampling rate for block 414 may bethe same or different as for block 402 or block 408. The process 401continues at a decision block 416 where the measured static forceF_(static) is compared to a minimum imaging threshold force level,F_(image,min). The minimum imaging threshold level may the minimum forceat which ultrasonic imaging of a fingerprint can be performed to obtainan image sufficiently accurate and detailed for authentication. If thestatic force is less than the minimum imaging threshold level, theprocess may return to block 408 to determine whether a finger has beenlifted.

If the static force measured at block 416 is greater or equal to theminimum imaging threshold level, the process 401 continues at a decisionblock 418 where the measured static force F_(static) is compared to amaximum imaging threshold level, F_(image,max). The maximum imagingthreshold level may be the maximum force at which ultrasonic imaging ofa fingerprint can be performed to obtain an image sufficiently accurateand detailed for authentication. If the static force is greater than themaximum imaging threshold level, the process may return to block 414 anda maximum imageable-finger condition may be entered. The maximumimageable-finger condition may be entered when the measured finger forceis greater than the maximum imaging threshold level, also referred to asthe maximum imageable-finger threshold level. If the static force isless than or equal to the maximum imaging threshold level and the staticforce is greater than the minimum imaging threshold level, the process401 may enter an imageable-finger condition and continues withultrasonic fingerprint imaging at block 420 and running anauthentication process at block 422, as described above with respect toFIG. 4A. The imageable-finger condition may be entered when the measuredfinger force is greater than the minimum imaging threshold level, alsoreferred to as the minimum imageable-finger threshold level. In someimplementations, the imageable-finger condition may be entered when themeasured finger force is greater than the minimum imageable-fingerthreshold level and less than the maximum imageable-finger thresholdlevel. In some implementations, the minimum imageable-finger thresholdlevel may be equal to or greater than the pressed-finger thresholdlevel.

In one example, a minimum imaging threshold level may be 40 gf and amaximum imaging threshold level may be 80 gf. However, it is understoodthat these threshold levels may depend on the particular sensor, deviceand/or user. In some implementations, user-specific imaging thresholdlevels may be determined during an enrollment process. In someimplementations, there may not be a maximum imaging threshold level withthe process 401 proceeding directly from block 416 to block 420.

In some implementations, an enrollment process is performed in which anapplied finger force is measured. A range of images at different forcesmay be stored as part of the enrollment process, e.g., image 1 at 40 gf,image 2 at 50 gf, etc., and the measured finger force may be stored aspart of one or more enrollment templates that include the associatedfingerprint image information. During a subsequent authenticationprocess, the force of the imaged finger may be compared to the storedfinger force of the enrollment templates using a force-ranked comparisonmethod. For example, if a fingerprint is imaged at a finger force of 50gf, an enrollment template having a finger force at or near 50 gf may beused first during the authentication process in an attempt to verifythat the user is an enrolled user.

FIG. 5A is an example of a diagram 500 illustrating applied finger forceversus time for finger-touch detection and finger-lift detection eventsof a fingerprint sensor operating in a non-ultrasonic force detectionmode. Ten sampling events, t₁-t₁₀ are shown, each having a duration oft_(sample). The on-threshold level, F_(on,min) and the off-thresholdlevel, F_(off,max) are indicated on the y-axis. At 502, between samplingevents t₂ and t₃, a finger begins to touch the fingerprint sensor. At504, as the finger continues pressing, the applied finger force isgreater than the on-threshold level, F_(on,min). Then, at 506, theapplied finger force is measured to be greater than the on-thresholdlevel, F_(on,min), indicating a minimum-force touch detection, whichinitializes wake-up operations and may send a wake-up signal to anapplications processor to activate one or more wake-up operations.Wake-up and continued operations 520 of the device, which may includeperforming imaging and authentication operations, are performed. Betweent₆ and t₇, the finger begins to lift. At 508, the applied finger forceis less than the off-threshold level F_(off,max). The finger is liftedoff the device at 510, which is detected at 512, the next samplingevent. Continuing operations 522 may be performed, such as sampling in anon-ultrasonic force detection mode and running background applications.In some implementations, the pressed-finger condition may be entered at506 when the measured finger force exceeds the pressed-finger thresholdlevel (F_(on,min)). The lifted-finger condition may be entered when theapplied finger force is measured and determined at 512 to be less thanthe lifted-finger threshold level (F_(off,max)).

FIG. 5B is an example of a diagram 501 illustrating applied finger forceversus time for imaging performed by a fingerprint sensor operating inan ultrasonic imaging mode. The events 502-512 related to finger-touchdetection and finger-lift detection, as described above with respect toFIG. 5A, are shown on the diagram 501, although it should be noted thatsome occur at different sampling events than in the example of FIG. 5A.

The minimum imaging threshold level, F_(image,min) and maximum imagingthreshold level, F_(image,max) are indicated on the y-axis. In theexample of FIG. 5B, at 514, the applied finger force is measured to begreater than the minimum imaging threshold level, F_(image,min). Thisinitializes an image acquisition operation 526 with the fingerprintsensor operating in the ultrasonic imaging mode to acquire or obtainultrasonic images and/or fingerprint image information of the finger. Anauthentication process 528 is then performed. Continued operations 524may then be performed. If the fingerprint is authenticated, continuedoperations 524 may include running various applications on a mobiledevice. In the example of FIG. 5B, continuing operations 522 such assampling in a non-ultrasonic force detection mode may continue duringthe continued operations 524, however, in some implementations, samplingin the non-ultrasonic force detection mode may not continue if thedevice is being actively used after authentication. In someimplementations, an imageable-finger condition may be entered at 514,with the finger imaged when the measured finger force exceeds theminimum imageable-finger threshold level (F_(image,min)) and, in someimplementations, is also less than the maximum imageable-fingerthreshold level (F_(image,max)).

FIG. 6 is an example of a diagram 600 illustrating a non-ultrasonicforce/touch detection mode and an ultrasonic imaging mode of afingerprint sensor versus applied finger force. The on-threshold levelF_(on,min), the off-threshold level F_(off,max), the minimum imagingthreshold level F_(image,min), and the maximum imaging threshold levelF_(image,max) are indicated. It should be noted that the thresholdlevels associated with the applied force are illustrative. In thescenario shown, a minimum of 20 gf (F_(on,min)) is needed forminimum-force finger-touch detection and less than 10 gf (F_(off,max))for finger-lift detection. A minimum of 40 gf (F_(image,min)) is neededfor fingerprint imaging. Beyond 80 gf of applied force (F_(image,max)),imaging may be halted. However, as described above with respect to FIGS.4A and 4B, these threshold levels may vary based on one or more of theparticular sensor system, device, or user.

In the example of FIG. 6, the fingerprint sensor may be in an ultrasonicimage mode 602 only when the applied finger force is between 40 gf and80 gf, the minimum and maximum imaging threshold levels, respectively.As indicated above with respect to FIG. 4B, in some implementations,there may not be a maximum imaging threshold level. Also, in the exampleof FIG. 6, the non-ultrasonic force/touch detection mode 604 may beimplemented at all applied finger forces. It should be noted thatbetween 40 gf and 80 gf, the fingerprint sensor may either be inultrasonic imaging mode 602 or in non-ultrasonic force detection mode604. For example, if a fingerprint has not been imaged or authenticated,the ultrasonic imaging mode may be activated when the applied fingerforce is measured to be within 40 gf and 80 gf. However, if afingerprint has already been authenticated and the device is in use, thefingerprint sensor may be in the non-ultrasonic detection mode in thisapplied finger force range to determine, for example, whether the fingerhas been lifted or not. As indicated above, in some implementations, thenon-ultrasonic detection mode may be employed only when the device is ina sleep mode or otherwise off.

In some implementations, a PMUT sensor element may include atwo-dimensional (2-D) electron gas structure such as a 2-D gastransistor that is strain-sensitive. A 2-D electron gas structure may bedisposed on or fabricated with a diaphragm of a PMUT sensor element. Anon-ultrasonic force detection mode may employ a static displacementsignal from the 2-D electron gas structure indicating a degree of straindue to a static displacement of the diaphragm and that corresponds tothe applied force. Examples of 2-D electron gas (e.g., “two-dimensionalelectron gas” or “2DEG”) structures that may be employed include highelectron mobility transistor (HEMT) structures. In a particular example,aluminum gallium nitride/gallium nitride (AlGaN/GaN) heterostructuresincluding AlGaN/GaN transistors and AlGaN/GaN Schottky diodes may beemployed.

FIGS. 7A-7C illustrate an example of a PMUT sensor element 700 thatincludes a 2-D electron gas structure. FIG. 7A illustrates a side viewof the PMUT sensor element; FIG. 7B illustrates a top view of the PMUTsensor element; and FIG. 7C is a schematic of an equivalent circuit ofthe PMUT sensor element 700 shown in FIGS. 7A and 7B.

The PMUT sensor element 700 is similar to that depicted in FIGS. 1A-1D,with the addition of a 2-D electron gas structure 740, which is formedon an outer region of the mechanical layer 730 of the PMUT diaphragm. Anenlarged view of an example of a 2-D electron gas structure 740 is shownin FIG. 7D. The PMUT diaphragm includes a piezoelectric layer stack 710and a mechanical layer 730 supported by an anchor structure 770 over acavity 720. The cavity 720 may be formed in or on a substrate 760.

The piezoelectric layer stack 710 includes a piezoelectric layer 715, alower electrode 712 and an upper electrode 714. The upper electrode 714in the illustrated implementation may also be referred to as an innerelectrode as it is disposed over an interior portion of the deformablediaphragm.

An equivalent circuit of the PMUT sensor element 700 is shown in FIG.7C. Each of the terminals depicted may be connected to transceivercircuitry, with the 2-D electron gas structure used during thenon-ultrasonic force detection mode and/or in the ultrasonic imagingmode. The strain-sensitive 2-D electron gas structure may be used fordetecting vibrations or other dynamic deformations instead of or inaddition to detecting static deflections. For example, in someimplementations, the piezoelectric layer stack 710 may be configured toexcite the diaphragm and generate ultrasonic waves while the 2-Delectron gas structure serves as a receiver element to detect reflectedultrasonic waves. In such implementations, the upper electrode 714 maybe configured as a drive electrode and the 2-D electron gas structure740 may be configured as a sense electrode. Similarly, in someimplementations, the upper electrode 714 may be configured as a senseelectrode and the 2-D electron gas structure 740 configure as a driveelectrode.

FIG. 7D illustrates a side view of an example of a 2-D electron gasstructure 740 that may be implemented with or without the PMUT sensorelements described herein. In the example of FIG. 7D, the 2-D electrongas structure 740 is an AlGaN/GaN transistor that includes a GaN bufferlayer 782, a GaN body layer 784, an AlGaN gate dielectric layer 786, asource (S) stack 788, a drain (D) stack 790, and a gate (G) stack 792.In one example, the source stack 788 and the drain stack 790 may betitanium/aluminum/nickel/gold (Ti/Al/Ni/Au) stacks and the gate stack792 may be a Ni/Au stack. A passivation layer (not shown) such assilicon nitride (SiN) or other appropriate dielectric material may beconformally deposited over the 2-D electron gas structure 740. Metalinterconnects (not shown) provide connections between the source stack788, the drain stack 790, the gate stack 792, and appropriate controllercircuitry.

The 2-D electron gas structure 740 may be formed on the mechanical layer730 of a PMUT sensor element 700 by standard thin-film processingtechniques such as metal-organic chemical vapor deposition (MOCVD) ormolecular beam epitaxy (MBE) deposition, lithographic patterning andetching. In some implementations, a 2-D electron gas structure may befabricated during fabrication of the mechanical layer of a PMUT sensorelement, forming an integral part of the mechanical layer.

In some implementations, a 2-D electron gas structure may be formed onor with a diaphragm that is not an ultrasonic transducer to form anon-ultrasonic sensor element. Structurally, such a sensor element maybe similar to that shown in FIG. 7A, including the 2-D electron gasstructure 740 on a mechanical layer 730 that is suspended over a cavity720. A piezoelectric layer stack 710 may or may not be present. Asdiscussed further below, a non-ultrasonic sensor element including a 2-Delectron gas structure on a diaphragm may be incorporated into anultrasonic sensor array that includes PMUT sensor elements. In someimplementations, a non-ultrasonic sensor element including a 2-Delectron gas structure on a diaphragm or other structure such as acantilevered beam may be incorporated into any appropriate sensor arrayor otherwise used to provide highly sensitive force detection.

FIGS. 8-13 illustrate examples of various configurations of ultrasonicsensor arrays that are configured to switch between a non-ultrasonicforce detection mode and an ultrasonic imaging mode. In someimplementations, only a subset of PMUT sensor elements in an array ofPMUT sensor elements are used for force detection in the non-ultrasonicforce detection mode. This is because, in some implementations, accurateforce measurements may be obtained using only a subset of the PMUTsensor elements.

FIG. 8 illustrates an example of an ultrasonic sensor array 800including PMUT sensor elements 802 and PMUT sensor elements 804 formedon a substrate 860. The PMUT sensor elements 802 are shown as circularPMUT sensor elements. Examples of circular PMUT sensor elements aredescribed with reference to FIGS. 1A-1D, above, and with reference toFIGS. 14A-14C, below. It will be understood that these PMUT sensorelements may be any appropriate shape. In some implementations, the PMUTsensor elements 802 are not used for force detection in thenon-ultrasonic force detection mode. PMUT sensor elements 804 are largerthan the PMUT sensor elements 802 and are shown as rectangular. Examplesof rectangular PMUT sensor elements are described below with referenceto FIGS. 15A-15C and FIGS. 16A-16C. It will be understood that thesePMUT sensor elements may be any appropriate shape and size. In someimplementations, the PMUT sensor elements 804 that are used fornon-ultrasonic force detection may be larger than the PMUT sensorelements 802 that are used solely for ultrasonic imaging. The PMUTsensor elements 804, used during non-ultrasonic force detection mode todetect applied force as described above, are located on the periphery ofthe ultrasonic sensor array 800. By placing the PMUT sensor elements 804used for force detection around the periphery, the ultrasonic sensorarray may be used for centering detection. While only the PMUT sensorelements 804 are used for non-ultrasonic force detection, both PMUTsensor elements 802 and PMUT sensor elements 804 may be used forultrasonic imaging as described above with respect to FIG. 2. That is,the PMUT sensor elements 804 may initially be used to statically detectforce from a finger press and then be switched to an ultrasonic mode forultrasonic imaging in some implementations. In alternativeimplementations, the PMUT sensor elements 804 may be used only for forcedetection, with only the PMUT sensor elements 802 used for ultrasonicimaging. In some implementations, PMUT sensor elements 804 near theperiphery of the ultrasonic sensor array 800 may be used for cursor,pointer or icon control, or for screen navigation on a display of amobile device.

FIG. 9 illustrates an example of an ultrasonic sensor array 900including PMUT sensor elements 902 and PMUT sensor elements 904 formedon a substrate 960. The PMUT sensor elements 904, which are on theperiphery of the array forming the outermost edge of the array, may beused exclusively for non-ultrasonic force detection or for bothnon-ultrasonic force detection and ultrasonic imaging. The PMUT sensorelements 902, located in the interior of the array, may be used forultrasonic imaging and may or may not be used for non-ultrasonic forcedetection in some implementations.

In some implementations, the PMUT sensor elements 904 include 2-Delectron gas structures for force detection. In some implementations,the sensor elements 904 may include piezoelectric layer stacks, 2-Delectron gas structures, or both piezoelectric layer stacks and 2-Delectron gas structures. Examples of PMUT sensor elements that include2-D electron gas structures are described above with respect to FIGS.7A-7D and further below with respect to FIGS. 17A-17C. Inimplementations in which the PMUT sensor elements 902 are not used forforce detection, sensor elements 902 may or may not include 2-D electrongas structures. In implementations where the PMUT sensor elements 904are used for non-ultrasonic force detection, both PMUT sensor elements902 and PMUT sensor elements 904 may be used for ultrasonic imaging. Insome implementations, the PMUT sensor elements 904, with or without 2-Delectron gas structures, may be used for cursor control, screennavigation, and control purposes.

FIG. 10 illustrates an example of an ultrasonic sensor array 1000including PMUT sensor elements 1002 and PMUT sensor elements 1004 formedon a substrate 1060. The PMUT sensor elements 1004, which are located onthe periphery of the array and form the outermost edge of the array, maybe used for either or both non-ultrasonic force detection and ultrasonicimaging. The PMUT sensor elements 1002, located in the interior of thearray, may be used for ultrasonic imaging and not for non-ultrasonicforce detection in some implementations. As in FIG. 8, the PMUT sensorelements 1004 are rectangular and larger than the PMUT sensor elements1002. The PMUT sensor elements 1004 may be used, in someimplementations, for cursor control, screen navigation, and controlpurposes.

FIG. 11 illustrates an example of an ultrasonic sensor array 1100including PMUT sensor elements 1102 and sensor elements 1104 formed on asubstrate 1160. The sensor elements 1104, which are located on theperiphery of the array and form the outermost edge of the array, may beused for non-ultrasonic force detection and may or may not be used forultrasonic imaging. The PMUT sensor elements 1102, located in theinterior of the array, may be used for ultrasonic imaging and may or maynot be used for non-ultrasonic force detection in some implementations.As in FIG. 8, the PMUT sensor elements 1004 are rectangular and largerthan the PMUT sensor elements 1002. In the example of FIG. 11, thesensor elements 1104 may provide x- and y-cursor or pointer control,with sensor elements 1110 providing x-cursor or x-pointer control andsensor elements 1108 providing y-cursor or y-pointer control.

FIG. 12 illustrates an example of an ultrasonic sensor array 1200including PMUT sensor elements 1204 formed on a substrate 1260. In theexample of FIG. 12, a subset or all of the PMUT sensor elements 1204 inthe array may be used for both non-ultrasonic force detection andultrasonic imaging. In some implementations, the PMUT sensor elements1204 may include 2-D electron gas structures as described, for example,with FIGS. 7A-7D and 17A-17C along with piezoelectric layer stacks. Insome implementations, the PMUT sensor elements 1204 may not include 2-Delectron gas structures as described, for example, with reference toFIGS. 1A-1E, FIGS. 14A-C, FIGS. 15A-15C, and FIGS. 16A-16C.

As indicated above, in some implementations, a 2-D electron gasstructure may be formed on or with a diaphragm that does not serve as anultrasonic transducer to form a non-ultrasonic sensor element. FIG. 13illustrates an example of an ultrasonic sensor array 1300 including PMUTsensor elements 1302 formed on a substrate 1360 and non-ultrasonic forcesensor elements 1306 that include 2-D electron gas structures ondiaphragms. In some implementations, each PMUT sensor element 1302 inthe ultrasonic sensor array 1300 may have a corresponding non-ultrasonicforce sensor element 1306 in close proximity. In some implementationssuch as shown in FIG. 13, each sensor element 1302 may include apiezoelectric layer stack and each sensor element 1306 may include a 2-Delectron gas structure.

The ultrasonic sensor arrays depicted in FIGS. 8-13 may be configured asa home button of a mobile device or as a standalone fingerprint sensor.Still further, they may be implemented on three-dimensional (3-D) miceand haptic devices.

FIGS. 14A-17D illustrate examples of PMUT sensor elements that may beimplemented in an ultrasonic sensor array according to variousimplementations. FIGS. 14A and 14B illustrate side views of an exampleof a three-port PMUT sensor element 1400 operating in a non-ultrasonicforce detection mode and ultrasonic imaging mode, respectively. FIG. 14Cshows a top view of the PMUT sensor element 1400 shown in FIGS. 14A and14B. FIG. 14D shows an equivalent circuit for the PMUT sensor elementshown in FIGS. 14A and 14B. The PMUT sensor element 1400 includes apiezoelectric layer stack 1410 and a mechanical layer 1430 disposed soas to form a deformable diaphragm supported by an anchor structure 1470over a cavity 1420. The cavity 1420 may be formed in or on a substrate1460. The piezoelectric layer stack 1410 includes a piezoelectric layer1415, a lower electrode 1412 and two upper electrodes: an innerelectrode 1414 and outer electrode 1413.

In the illustrated implementation, the inner electrode 1414, the outerelectrode 1413, and the lower electrode 1412 may be electrically coupledwith transceiver circuitry and may function as separate electrodesproviding signal transmission, signal reception, and a common referenceor ground. This arrangement allows timing of transmit (Tx) and receive(Rx) signals to be independent of each other. More particularly, theillustrated arrangement enables substantially simultaneous transmissionand reception of signals between the piezoelectric ultrasonic transducer(PMUT) sensor element 1400 and the transceiver circuitry.

FIG. 14A is a side view of the PMUT sensor element 1400 with staticdisplacement due to an applied force. As described above with respect toFIG. 1C, in operation, the piezoelectric layer stack 1410 and themechanical layer 1430 may be caused to bend in response to an appliedforce, which the PMUT sensor element converts to an electrical signalthat may be read by the transceiver circuitry.

FIG. 14B is a side view of the PMUT sensor element 1400 with dynamicdisplacement due to ultrasonic wave generation and detection. Asdescribed above with respect to FIG. 1D, during operation in anultrasonic imaging mode, the piezoelectric layer stack 1410 and themechanical layer 1430 may be caused to bend and vibrate in response to atime-varying excitation voltage applied across the inner electrode 1414and/or outer electrode 1413 by transceiver circuitry. As a result, oneor more ultrasonic pressure waves having frequencies in an ultrasonicfrequency band may be propagated into air, a platen, a cover glass, adevice enclosure, or other propagation medium that overlies the PMUTsensor element 1400. The piezoelectric layer stack 140 may likewisereceive reflected ultrasonic pressure waves from an object in thepropagation medium, and convert the received ultrasonic pressure wavesinto electrical signals that may be read by transceiver circuitry.

The PMUT sensor elements may have various geometries, including but notlimited to circular and rectangular geometries. In some embodiments, anultrasonic array may include PMUT sensor elements having differentgeometries.

For example, as described above with respect to FIGS. 10 and 11, PMUTsensor elements that are used for non-ultrasonic force detection as wellfor ultrasonic imaging may have a different geometry than PMUT sensorelements that are used only for ultrasonic imaging. FIGS. 15A and 15Billustrate side views of an example of a two-port PMUT sensor element1500 having a rectangular geometry operating in a non-ultrasonic forcedetection mode and an ultrasonic imaging mode, respectively. FIG. 15Cshows a top view of the PMUT sensor element 1500 shown in FIGS. 15A and15B. FIG. 15D shows an equivalent circuit for the PMUT sensor elementshown in FIGS. 15A and 15B.

The PMUT sensor element 1500 includes a piezoelectric layer stack 1510and a mechanical layer 1530 disposed so as to form a deformablediaphragm supported by an anchor structure 1570 over a cavity 1520. Thecavity 1520 may be formed in or on a substrate 1560. The piezoelectriclayer stack 1510 includes a piezoelectric layer 1515, a lower electrode1512 and an upper electrode 1514. The upper electrode 1514 is alsoreferred to as an inner electrode. FIG. 15A is a side view of the PMUTsensor element 1500 with static displacement due to applied force asdescribed above with respect to FIG. 1C. FIG. 15B is a side view of thePMUT sensor element 1500 with dynamic displacement due to ultrasonicwave generation and detection as described above with respect to FIG.1D.

FIGS. 16A and 16B illustrate side views of an example of a three-portPMUT sensor element 1600 having a rectangular geometry operating in anon-ultrasonic force detection mode and ultrasonic imaging mode,respectively. FIG. 16C shows a top view of the PMUT sensor element 1600shown in FIGS. 16A and 16B. FIG. 16D shows an equivalent circuit for thePMUT sensor element shown in FIGS. 16A and 16B.

The PMUT sensor element 1600 includes a piezoelectric layer stack 1610and a mechanical layer 1630 disposed so as to form a deformablediaphragm supported by an anchor structure 1670 over a cavity 1620. Thecavity 1620 may be formed in or on a substrate 1660. The piezoelectriclayer stack 1610 includes a piezoelectric layer 1615, a lower electrode1612 and two upper electrodes: an inner electrode 1614 and outerelectrode 1613.

As described above with respect to FIG. 14, the inner electrode 1614,outer electrode 1613, and lower electrode 1612 may be electricallycoupled with transceiver circuitry and may function as separateelectrodes providing signal transmission, signal reception, and a commonreference or ground. FIG. 16A is a side view of the PMUT sensor element1600 with static displacement due to applied force. As described abovewith respect to FIG. 1C, in operation, the piezoelectric layer stack1610 and the mechanical layer 1630 may be caused to bend in response toan applied force, which the PMUT sensor element converts to anelectrical signal that may be read by the transceiver circuitry.

FIG. 16B is a side view of the PMUT sensor element 1600 with dynamicdisplacement due to ultrasonic wave generation and detection. Asdescribed above with respect to FIG. 1D, during operation in anultrasonic imaging mode, the piezoelectric layer stack 1610 and themechanical layer 1630 may be caused to bend and vibrate in response to atime-varying excitation voltage applied across the inner electrode 1614and/or outer electrode 1613 by the transceiver circuitry.

FIGS. 17A-17D illustrate an example of a PMUT sensor element 1700 thatincludes a 2-D electron gas structure. The example of FIG. 17A-17D issimilar to that described above with respect to FIGS. 7A-7D with theupper electrode being an outer electrode, rather than an innerelectrode. FIGS. 17A and 17B illustrate side views of an example of thePMUT sensor element 1700 operating in a non-ultrasonic force detectionmode and ultrasonic imaging mode, respectively. FIG. 17C shows a topview of the PMUT sensor element 1700 shown in FIGS. 17A and 17B. FIG.17D shows an equivalent circuit for the PMUT sensor element shown inFIGS. 17A and 17B.

The PMUT sensor element 1700 includes a 2-D electron gas structure 1740formed on the mechanical layer 1730 of the PMUT diaphragm. In theexample of FIGS. 17A-17C, the 2-D electron gas structure is disposed inthe center of a circular diaphragm, rather than on the periphery asshown in FIGS. 7A and 7B. The deformable diaphragm includes apiezoelectric layer stack 1710 and a mechanical layer 1730 supported byan anchor structure 1770 over a cavity 1720. The cavity 1720 may beformed in or on a substrate 1760. The piezoelectric layer stack 1710includes a piezoelectric layer 1715, a lower electrode 1712 and an upperelectrode 1713. The upper electrode 1713 in the illustratedimplementation may also be referred to as an outer electrode as it isdisposed around an outer peripheral portion of the diaphragm.

FIG. 17A is a side view of the PMUT sensor element 1700 with staticdisplacement due to an applied force. As described above with respect toFIG. 1C, in operation, the piezoelectric layer stack 1710 and themechanical layer 1730 may be caused to bend in response to an appliedforce, which the PMUT sensor element 1700 converts to an electricalsignal that may be read by the transceiver circuitry.

FIG. 17B is a side view of the PMUT sensor element 1700 with dynamicdisplacement due to ultrasonic wave generation and detection. Asdescribed above with respect to FIG. 1D, during operation in anultrasonic imaging mode, the piezoelectric layer stack 1710 and themechanical layer 1730 may be caused to bend and vibrate in response to atime-varying excitation voltage applied across the outer electrode 1713and the lower electrode 1712 by transceiver circuitry. Similarly, the2-D electron gas structure 1740 may exhibit mechanical strain duringstatic displacement of the diaphragm with applied force or dynamicdisplacements of the diaphragm in response to reflected ultrasonicwaves, which may result in static or time-varying transistorcharacteristics that may be detected by the transceiver circuitry.

FIGS. 18A-18D illustrate an example of a process flow for fabricating asensor element 1800 including a substrate 1860, a diaphragm, and a 2-Delectron gas structure 1840 disposed on the diaphragm. The diaphragm mayinclude portions of a mechanical layer 1830 spanning a cavity 1820 withthe cavity 1820 positioned between the mechanical layer 1830 and thesubstrate 1860. The mechanical layer 1830 may be supported over thecavity 1820 by an anchor structure 1870. The substrate 1860 may includeone or more piezoelectric layers on the mechanical layer 1830, such asdescribed and illustrated above with respect to PMUT sensor element 700in FIG. 7A and with respect to PMUT sensor element 1700 in FIG. 17A.

The substrate 1860 may include a glass substrate or a semiconductorsubstrate such as a silicon substrate, an SOI substrate, or a cavity-SOIsubstrate. In some implementations, the substrate 1860 may include acavity-SOI substrate with one or more cavities 1820 formed between abonded pair of silicon substrates. In some implementations, thesubstrate 1860 may include one or more sealed cavities formed fromsurface micromachining processes that allow removal of sacrificialmaterial in the cavity region and subsequent sealing of etch channelregions (not shown) with one or more deposited thin films to establishand retain a prescribed vacuum level within the cavity 1820.

As shown in FIG. 18A, a buffer layer 1882 such as a gallium nitride(GaN) buffer layer may be deposited on the mechanical layer 1830 using,for example, a process such as metalorganic chemical vapor deposition(MOCVD) or molecular-beam epitaxy (MBE). In some implementations, a seedlayer of aluminum nitride (AlN) or a seed layer stack of aluminumnitride, molybdenum and aluminum nitride (AlN/Mo/AlN) may serve as thebuffer layer 1882. A body layer 1884 such as a GaN body layer may bedeposited epitaxially on the buffer layer 1882 using, for example, anMOCVD or MBE process. A gate dielectric layer 1886 such as analuminum-gallium-nitride (AlGaN) dielectric layer may be deposited onthe body layer 1884 using, for example, an MOCVD or MBE process. Thegate dielectric layer 1886, the body layer 1884, and the buffer layer1882 may be patterned and etched using, for example, a photolithographicprocess with a photo-sensitive material (e.g., photoresist) that servesas a mask for dry etching (e.g., plasma etching or reactive-ion etching)the AlGaN and GaN layers to form the body of the 2-D electron gasstructure 1840.

As shown in FIG. 18B, a source stack 1888 and a drain stack 1890 may beformed on the gate dielectric layer 1886. The source stack 1888 and thedrain stack 1890 may be formed by depositing a barrier layer 1850 oftitanium on the gate dielectric layer 1886, followed by depositing aconductive layer 1852 of aluminum, a second barrier layer 1854 ofnickel, and a second conductive layer 1856 of gold. The conductive layer1856, the barrier layer 1854, the conductive layer 1852, and barrierlayer 1850 may be patterned and etched using a photolithographic processand stopping on the gate dielectric layer 1886 to form the source stack1888 and drain stack 1890. Alternatively, the barrier layer 1850,conductive layer 1852, barrier layer 1854, and the conductive layer 1856may be patterned and etched using a lift-off process where the layersare deposited on a patterned photoresist layer with openings in thesource and drain regions and where the photoresist layer is subsequentlyremoved using a wet or dry etch process along with portions of theoverlying conductive and barrier layers, leaving the conductive andbarrier layers in the source and drain regions intact to form the sourcestack 1888 and the drain stack 1890. An annealing sequence such as arapid thermal anneal (RTA) sequence may be used to anneal the substrate1860 and layers formed thereon including the source stack 1888 and thedrain stack 1890, and to drive in dopant from the source and drainstacks through the gate dielectric layer 1886 and into the body layer1884.

A gate stack 1892 may be formed on the gate dielectric layer 1886, asshown in FIG. 18C. A barrier layer 1864 of nickel and a conductive layer1866 of gold may be deposited on the gate dielectric layer 1886 using,for example, sputtering or evaporative processes followed by patterningand etching of the conductive layer 1866 and barrier layer 1864.Alternatively, the gate stack 1892 may be formed using a lift-offprocess with deposited barrier and conductive layers.

A passivation layer 1868 such as a layer of silicon nitride may bedeposited over the exposed portions of substrate 1860 including thesource stack 1888, the gate stack 1892, and the drain stack 1890, asshown in FIG. 18D. The passivation layer 1868 may be patterned andetched to form contact openings and to expose outer portions of thesource stack 1888, the gate stack 1892, and the drain stack 1890. One ormore layers of interconnect metal (not shown) may be used to provideelectrical connections to the source, gate, and drain of the 2-Delectron gas structure 1840. In some implementations, a transfer processmay be used to transfer MBE- and MOCVD-deposited materials from acarrier substrate (not shown) onto the mechanical layer 1830 orsubstrate 1860.

As used herein, a phrase referring to “at least one of” a list of itemsrefers to any combination of those items, including single members. Asan example, “at least one of: a, b, or c” is intended to cover: a, b, c,a-b, a-c, b-c, and a-b-c.

The various illustrative logics, logical blocks, modules, circuits andalgorithm processes described in connection with the implementationsdisclosed herein may be implemented as electronic hardware, computersoftware, or combinations of both. The interchangeability of hardwareand software has been described generally, in terms of functionality,and illustrated in the various illustrative components, blocks, modules,circuits and processes described above. Whether such functionality isimplemented in hardware or software depends upon the particularapplication and design constraints imposed on the overall system.

The hardware and data processing apparatus used to implement the variousillustrative logics, logical blocks, modules and circuits described inconnection with the aspects disclosed herein may be implemented orperformed with a general purpose single- or multi-chip processor, adigital signal processor (DSP), an application specific integratedcircuit (ASIC), a field programmable gate array (FPGA) or otherprogrammable logic device, discrete gate or transistor logic, discretehardware components, or any combination thereof designed to perform thefunctions described herein. A general purpose processor may be amicroprocessor or any conventional processor, controller,microcontroller, or state machine. A processor also may be implementedas a combination of computing devices, e.g., a combination of a DSP anda microprocessor, a plurality of microprocessors, one or moremicroprocessors in conjunction with a DSP core, or any other suchconfiguration. In some implementations, particular processes and methodsmay be performed by circuitry that is specific to a given function.

In one or more aspects, the functions described may be implemented inhardware, digital electronic circuitry, computer software, firmware,including the structures disclosed in this specification and theirstructural equivalents thereof, or in any combination thereof.Implementations of the subject matter described in this specificationalso may be implemented as one or more computer programs, i.e., one ormore modules of computer program instructions, encoded on a computerstorage media for execution by or to control the operation of dataprocessing apparatus.

If implemented in software, the functions may be stored on ortransmitted over as one or more instructions or code on acomputer-readable medium, such as a non-transitory medium. The processesof a method or algorithm disclosed herein may be implemented in aprocessor-executable software module which may reside on acomputer-readable medium. Computer-readable media include both computerstorage media and communication media including any medium that may beenabled to transfer a computer program from one place to another.Storage media may be any available media that may be accessed by acomputer. By way of example, and not limitation, non-transitory mediamay include RAM, ROM, EEPROM, CD-ROM or other optical disk storage,magnetic disk storage or other magnetic storage devices, or any othermedium that may be used to store desired program code in the form ofinstructions or data structures and that may be accessed by a computer.Also, any connection may be properly termed a computer-readable medium.Disk and disc, as used herein, includes compact disc (CD), laser disc,optical disc, digital versatile disc (DVD), floppy disk, and blu-raydisc where disks usually reproduce data magnetically, while discsreproduce data optically with lasers. Combinations of the above shouldalso be included within the scope of computer-readable media.Additionally, the operations of a method or algorithm may reside as oneor any combination or set of codes and instructions on a machinereadable medium and computer-readable medium, which may be incorporatedinto a computer program product.

Various modifications to the implementations described in thisdisclosure may be readily apparent to those skilled in the art, and thegeneric principles defined herein may be applied to otherimplementations without departing from the spirit or scope of thisdisclosure. Thus, the claims are not intended to be limited to theimplementations shown herein, but are to be accorded the widest scopeconsistent with this disclosure, the principles and the novel featuresdisclosed herein. Additionally, as a person having ordinary skill in theart will readily appreciate, the terms “upper” and “lower”, “top” andbottom”, “front” and “back”, and “over”, “overlying”, “on”, “under” and“underlying” are sometimes used for ease of describing the figures andindicate relative positions corresponding to the orientation of thefigure on a properly oriented page, and may not reflect the properorientation of the device as implemented.

Certain features that are described in this specification in the contextof separate implementations also may be implemented in combination in asingle implementation. Conversely, various features that are describedin the context of a single implementation also may be implemented inmultiple implementations separately or in any suitable subcombination.Moreover, although features may be described above as acting in certaincombinations and even initially claimed as such, one or more featuresfrom a claimed combination may in some cases be excised from thecombination, and the claimed combination may be directed to asubcombination or variation of a subcombination.

Similarly, while operations are depicted in the drawings in a particularorder, this should not be understood as requiring that such operationsbe performed in the particular order shown or in sequential order, orthat all illustrated operations be performed to achieve desirableresults. Further, the drawings may schematically depict one more exampleprocesses in the form of a flow diagram. However, other operations thatare not depicted may be incorporated in the example processes that areschematically illustrated. For example, one or more additionaloperations may be performed before, after, simultaneously, or betweenany of the illustrated operations. In certain circumstances,multitasking and parallel processing may be advantageous. Moreover, theseparation of various system components in the implementations describedabove should not be understood as requiring such separation in allimplementations, and it should be understood that the described programcomponents and systems may generally be integrated together in a singlesoftware product or packaged into multiple software products.Additionally, other implementations are within the scope of thefollowing claims. In some cases, the actions recited in the claims maybe performed in a different order and still achieve desirable results.

What is claimed is:
 1. A method of operating a fingerprint sensorassociated with a mobile device, the method comprising: measuring afinger force of a finger positioned on the fingerprint sensor via anon-ultrasonic force detection mode of a piezoelectric sensor elementconfigured to perform the non-ultrasonic force detection mode and anultrasonic force detection mode; performing wake-up operations from alow-power state of the mobile device when the finger force exceeds afirst pressed-finger threshold level; switching to the ultrasonic forcedetection mode of the piezoelectric sensor element, and imaging thefinger when the finger force exceeds a second pressed-finger thresholdlevel; and authenticating the finger based on the imaging of the finger.2. The method of claim 1, wherein imaging the finger includes acquiringultrasonic image information of the finger and wherein authenticatingthe finger is based on the ultrasonic image information.
 3. The methodof claim 1, wherein imaging the finger includes acquiring ultrasonicimage information of the finger when the finger force exceeds a minimumimageable-finger threshold level corresponding to the second fingerpressed pressed-finger threshold level.
 4. The method of claim 1,wherein imaging the finger includes acquiring ultrasonic imageinformation of the finger when the finger force is less than a maximumimageable-finger threshold level.
 5. The method of claim 1, wherein theperforming of the wake- up operations further comprises waking up atleast a portion of the mobile device when the finger force exceeds thefirst pressed-finger threshold level.
 6. The method of claim 5, whereinwaking up at least the portion of the mobile device includes activatinga processor of the mobile device from a sleep mode or off state.
 7. Themethod of claim 5, wherein waking up at least the portion of the mobiledevice includes turning on a display.
 8. The method of claim 1, whereinmeasuring the finger force of the finger positioned on the fingerprintsensor comprises measuring a static force for one or more sensorelements of an ultrasonic sensor array.
 9. The method of claim 8,wherein the static force is measured in a non-ultrasonic mode.
 10. Themethod of claim 9, wherein imaging the finger comprises imaging thefinger ultrasonically.
 11. The method of claim 8, wherein the ultrasonicsensor array includes an array of piezoelectric micromechanicalultrasonic transducer (PMUT) sensor elements, wherein each PMUT sensorelement includes a diaphragm having a piezoelectric layer and amechanical layer, wherein the diaphragm is capable of a staticdisplacement upon application of an applied force and is capable of adynamic displacement when the PMUT sensor element receives or transmitsultrasonic signals.
 12. The method of claim 1, further comprisingdetecting a finger lift.
 13. The method of claim 12, further comprisingentering a lifted- finger condition by modifying operations in responseto the detection of the finger lift.
 14. The method of claim 13, whereinmodifying operations includes reducing a sampling rate for measuring thefinger force.
 15. The method of claim 12, wherein detecting the fingerlift includes determining that a measured finger force is less than anoff-threshold level.
 16. The method of claim 15, wherein theoff-threshold level is less than an on-threshold force used to detectfinger touch.
 17. The method of claim 1, further comprising performingan enrollment process, the enrollment process including storing a rangeof images obtained at different measured static forces.
 18. The methodof claim 1, wherein authenticating the finger includes comparing themeasured finger force to stored finger forces of an enrollment template.19. A fingerprint sensor associated with a computerized device, thefingerprint sensor comprising: a piezoelectric sensor element comprisinga non-ultrasonic force detection capability and an ultrasonic imagingcapability, the piezoelectric sensor element configured to: measure afinger force of a finger via the non-ultrasonic force detectioncapability; perform wake-up operations from a low-power state of thecomputerized device when the finger force exceeds a first pressed-fingerthreshold level; switch to the ultrasonic imaging capability and imagethe finger when the finger force exceeds a second pressed-fingerthreshold level; and authenticate the finger based on the imaging of thefinger.
 20. A method of operating a fingerprint sensor, the methodcomprising: measuring a finger force of a finger positioned on afingerprint sensor, the measuring of the finger force comprisingmeasuring a static force for one or more sensor elements of anultrasonic sensor array, the ultrasonic sensor array including an arrayof piezoelectric micromechanical ultrasonic transducer (PMUT) sensorelements, each PMUT sensor element including a diaphragm having apiezoelectric layer and a mechanical layer, wherein the diaphragm iscapable of a static displacement upon application of an applied forceand is capable of a dynamic displacement when the PMUT sensor elementreceives or transmits ultrasonic signals; imaging the finger when thefinger force exceeds a pressed-finger threshold level; and means forauthenticating the finger based on the imaging of the finger.